MOUNTING STRUCTURE FOR MULTI-CHIP MODULE

PROBLEM TO BE SOLVED: To provide a mounting structure for multi-chip module in which the area of a substrate can be reduced by mounting chip components in a BGA nonexisting area on the connecting face of the substrate. SOLUTION: In this mounting structure for multi-chip module, chip components 3, su...

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Bibliographic Details
Main Authors NAKATSUGI YASUTO, HATAKEYAMA AKIHITO, WATANABE MASAKI, ISHII MASAHIRO, TAKATORI MASAHIRO
Format Patent
LanguageEnglish
Published 16.12.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a mounting structure for multi-chip module in which the area of a substrate can be reduced by mounting chip components in a BGA nonexisting area on the connecting face of the substrate. SOLUTION: In this mounting structure for multi-chip module, chip components 3, such as resistors, capacitors, etc., are used as connecting materials between substrates. Since the chip components 3 maintain the distance between a multi-chip module 1 and a substrate 2 at a fixed value, the area of the substrate can be reduced by mounting the chip components 3 in the BGA nonexisting area on the connecting face of the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030148727