LITHOGRAPHY APPARATUS, DEVICE MANUFACTURING METHOD, MASK, METHOD OF CHARACTERIZING MASK AND/OR PELLICLE

PROBLEM TO BE SOLVED: To provide a lithography projection apparatus and a device manufacturing method capable of compensating for or improving the effect of a thick pellicle. SOLUTION: The thick pellicle is characterized for calculating a correction to be applied in exposure so that the hick pellicl...

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Bibliographic Details
Main Authors JASPER JOHANNES CHRISTIAAN MARIA, PONGERS WILLEM RICHARD, VAN DIJCK HENDRIKUS ALPHONSUS LUDOVICUS, BOOM HERMAN, JANSEN ALBERT JOHANNES MARIA, HOFMANS GERARDUS CAROLUS JOHANNUS, BRULS RICHARD JOSEPH, WEHRENS MARTIJN GERARD DOMINIQ, UITTERDIJK TAMMO, CICILIA ORLANDO SERAPIO, DEMARTEAU MARCEL JOHANNES LOUIS MARIE, BAGGEN MARCEL KOENRAAD MARIE, LUIJTEN CARLO CORNELIS MARIA
Format Patent
LanguageEnglish
Published 02.12.2004
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a lithography projection apparatus and a device manufacturing method capable of compensating for or improving the effect of a thick pellicle. SOLUTION: The thick pellicle is characterized for calculating a correction to be applied in exposure so that the hick pellicle is allowed to have a non-flat shape and the shape compensates for the optical effect of the pellicle. As the pellicle readily compensates for, it can be mounted in such a manner as to employ a one-dimensional shape under the influence of gravity. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20040132528