METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD WITH CAVITY

• Main Author: OONAGANE OSAMU
• Format: Patent
• Language: English
• Published: 25.11.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board with cavities by which the bad influence by variations in thickness between layers or in thickness of a conductor can be prevented. SOLUTION: The method of manufacturing the multilayer printed wiring board with cavities comprises processes of forming a cavity 2 by spot facing in a copper clad laminate 1 which constitutes a base layer in such a manner that it is extended through a resin layer 1-1 to expose a copper layer 1-2 before making the copper clad laminate into a multilayer structure, filling the cavity with a metal 3 different from copper, forming copper plating layers 4-1 and 4-2 on both faces of the copper clad laminate, forming circuit patterns 5-1 and 5-2 from the copper plating layers including the copper layer on both faces of the copper clad laminate, forming insulation layers 6-1 and 6-2 and circuit patterns 8-1 and 8-2 each forming at least a single layer on both faces of the copper clad laminate to laminate into a multilayer structure, forming a cavity 9 by spot facing from one face side of the copper clad laminate to the metal 3, and removing the metal by etching. COPYRIGHT: (C)2005,JPO&NCIPI