SEMICONDUCTIVE BELT AND ITS MANUFACTURING METHOD

• Main Author: IWAMOTO TOSHIAKI
• Format: Patent
• Language: English
• Published: 28.10.2004
• Edition: 7
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CINEMATOGRAPHY; ELECTROGRAPHY; ELECTROPHOTOGRAPHY; HOLOGRAPHY; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; MAGNETOGRAPHY; PERFORMING OPERATIONS; PHOTOGRAPHY; PHYSICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a semiconductive belt which is excellent in the environmental stability of electric characteristics such as a surface resistance while making the best use of excellent mechanical characteristics, and capable of transferring a good image to a recording sheet even in the case the belt is used as an intermediate transfer belt for an electrophotographic recording device, and also, capable of maintaining a good performance of satisfactorily separating the transfer sheet in carrying for a long period of time, and to provide a semiconductive belt manufacturing method. SOLUTION: The semiconductor belt is characterised in that the conductive filler contained are evenly dispersed on the whole cross section of the belt, and a surface resistivity difference between the outer surface and the inner surface and a ratio of the surface resistivity of the outer surface to that of the inner surface are controlled within prescribed extents. In this case, it is preferable that the average particle diameter of the conductive filler is equal to or below a prescribed value. Besides, it is preferable that the conductive filler is carbon black and the heat-resistant resin is a polyamideimide-based resin. COPYRIGHT: (C)2005,JPO&NCIPI