DEVICE FOR PLATING ELECTRONIC COMPONENT, AND METHOD FOR PLATING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a device for plating an electronic component which stabilizes the thickness of plating and a method therefor. SOLUTION: The device for plating an electronic component is equipped with: a plating tank storing a plating liquid; and a cylindrical barrel 1 provided so as...

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Bibliographic Details
Main Authors MIKAMOTO NAOHIRO, HAYASE JUNICHI
Format Patent
LanguageEnglish
Published 28.10.2004
Edition7
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:PROBLEM TO BE SOLVED: To provide a device for plating an electronic component which stabilizes the thickness of plating and a method therefor. SOLUTION: The device for plating an electronic component is equipped with: a plating tank storing a plating liquid; and a cylindrical barrel 1 provided so as to be dipped into the plating liquid and having many liquid passing holes on the circumferential wall. The device is further equipped with; first conduits 2 whose one end part is faced to the inside of the barrel 1; and pumps 4 connected to the other end part 2b of each first conduit 2 and for injecting or sucking the plating liquid. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030091178