EXPOSURE MASK, EXPOSURE METHOD, AND PROCESS FOR FABRICATING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an exposure mask requiring no complementary division of an opening-like exposure pattern, an exposure method using that exposure mask, and a process for fabricating a semiconductor device. SOLUTION: In the exposure mask 1 where a doughnut pattern 3 and a plurality of...

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Bibliographic Details
Main Author NOUDO SHINICHIRO
Format Patent
LanguageEnglish
Published 21.10.2004
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an exposure mask requiring no complementary division of an opening-like exposure pattern, an exposure method using that exposure mask, and a process for fabricating a semiconductor device. SOLUTION: In the exposure mask 1 where a doughnut pattern 3 and a plurality of long patterns 5 are provided on a thin film membrane 2 as an opening-like exposure pattern, a crosslinking pattern 7 thinner than the minimum line width of the doughnut pattern 3 and the long patterns 5 is stretched across the opposite sides at the opening part of the doughnut pattern 3 and the long patterns 5. In the pattern exposure using that exposure mask 1, only the doughnut pattern 3 and the long patterns 5 are resolved while regulating light exposure within a range where the crosslinking pattern 7 is not resolved. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030089709