DOUBLE-SIDE COOLING TYPE SEMICONDUCTOR MODULE

• Main Authors: HIRANO NAOHIKO, TEJIMA TAKANORI
• Format: Patent
• Language: English
• Published: 21.10.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a double-side cooling type semiconductor module which is so structured that a semiconductor chip is cooled well. SOLUTION: The semiconductor module 100 is constituted such that a fixed cooling device 2 and a displaceable cooling device 3 are located above and below a flat semiconductor package 1. A relative position of the fixed cooling device 2 with respect to the semiconductor package 1 is fixed, while a relative position of the displaceable cooling device 3 with respect to the semiconductor package 1 can be changed. The displaceable cooling device 3 is equipped with a displaceable element 31 constituted of a metal thin plate for covering a cooling medium housing chamber 3a. The semiconductor module 100 is also equipped with a pressing mechanism 20 for pressing the fixed cooling device 2 toward the displaceable cooling device 3. By fastening adjustment screws 201 and 202 of the pressing mechanism 20, a pressing frame 203 is drawn closer to a cooling device body 32 of the displaceable cooling device 3, while pressing the semiconductor package 1 by the fixed cooling device 2 and displacing the displaceable element 31 by a small quantity. As a result, adhesiveness between the semiconductor package 1 and an insulating material 17 and between the insulating material 17 and the displaceable element 31 can be raised. COPYRIGHT: (C)2005,JPO&NCIPI