COMPOSITE, PREPREG AND LAMINATED BOARD

PROBLEM TO BE SOLVED: To provide a composite and a prepreg containing the same, excellent in board thickness accuracy and inner layer circuit embeddability when made into a laminated board, and to provide such a laminated board excellent in board thickness accuracy and inner layer circuit embeddabil...

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Bibliographic Details
Main Authors URATA YOSHITERU, EKUSA SHIGERU
Format Patent
LanguageEnglish
Published 21.10.2004
Edition7
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
GENERAL PROCESSES OF COMPOUNDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a composite and a prepreg containing the same, excellent in board thickness accuracy and inner layer circuit embeddability when made into a laminated board, and to provide such a laminated board excellent in board thickness accuracy and inner layer circuit embeddability. SOLUTION: The composite 1 is a sheet-like composite to be used for forming the laminated board being such one that a 1st resin composition is borne on a fibrous base and characterized in being porous. The prepreg is such one that both sides of the composite 1 are provided with a 1st resin layer comprising a 2nd resin composition and a 2nd resin layer comprising a 3rd resin composition, respectively. The laminated board is such one that one or more sheets of the prepreg and a carrier material are laminated together. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030086588