MICRO MACHINE

PROBLEM TO BE SOLVED: To provide an effective micro machining technology appropriate for yield improvement. SOLUTION: An Si contactor as a micro machine is manufactured where lattice-like regions are formed on a main surface 1a correspondingly to arrangement of a plurality of semiconductor chips on...

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Bibliographic Details
Main Authors NANBA IRIZOU, MATSUZAKA HIROSHI, KANAMARU MASATOSHI, NEZU YUICHI
Format Patent
LanguageEnglish
Published 21.10.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide an effective micro machining technology appropriate for yield improvement. SOLUTION: An Si contactor as a micro machine is manufactured where lattice-like regions are formed on a main surface 1a correspondingly to arrangement of a plurality of semiconductor chips on a semiconductor wafer to be inspected, and each lattice-like region is provided with a plurality of projecting probes and wiring patterns corresponding to electrodes of the semiconductor chips. When each Si contactor is acquired by performing dicing along a dicing line on the semiconductor substrate 1 having a plurality of Si contactors, thickness of a wiring layer 1e in a place where a dicing blade 3 runs is less than that in the other place. A sag amount of metal wiring of the wiring layer 1e formed by dicing is reduced, and therefore, occurrence of leak failure is reduced to improve yield of products (Si contactors). COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030089718