THERMOSETTING COMPOSITION FOR SEALING LIGHT EMITTING ELEMENT, AND LIGHT EMITTING DIODE

PROBLEM TO BE SOLVED: To provide a light emitting element having high light resistance and heat resistance, especially a thermosetting composition for sealing light emitting element whose emission wavelength is 250-550 nm and a light emitting diode without getting soft at using in which luminance is...

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Bibliographic Details
Main Authors USUI TAKETOSHI, KACHI HAJIME
Format Patent
LanguageEnglish
Published 14.10.2004
Edition7
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a light emitting element having high light resistance and heat resistance, especially a thermosetting composition for sealing light emitting element whose emission wavelength is 250-550 nm and a light emitting diode without getting soft at using in which luminance is scarcely deteriorated for a long time. SOLUTION: This thermosetting composition for sealing light emitting element contains (A) 100 parts by weight of a modified polysiloxane in which two or more epoxy radicals is included in one molecule, (B) 0-100 parts by weight of an epoxide resin and (C) 1-200 parts by weight of a curing agent for epoxide resin. This invention contains the light emitting diode using the thermosetting composition. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030156875