SUBSTRATE PROCESSOR

• Main Authors: KIHARA MASAMICHI, MATSUDA SATOYUKI
• Format: Patent
• Language: English
• Published: 14.10.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To detect a clearance between a susceptor and a substrate during a processing, to reflect a detection result on the substrate processing, and to improve processing quality and yield. SOLUTION: This substrate processor is provided with a processing chamber 18 for processing a substrate, a substrate placing stand 19 for holding the substrate 15 in the processing chamber, and a heating device 28 for heating the substrate. The substrate placing stand is provided with a gap sensor 51 for detecting a gap between the substrate placing stand and the substrate, and the gap sensor is configured so that a light detecting part can be arranged so as to be faced to the substrate, and the light detecting part is configured so that light projecting optical fiber wires and light receiving optical fiber wires can be held in a fiber holder. COPYRIGHT: (C)2005,JPO&NCIPI