AUTOMATIC SOLDERING DEVICE

PROBLEM TO BE SOLVED: To provide an automatic soldering device which carries out soldering in an inert gas atmosphere, is capable of lowering oxygen in concentration in a jet flow solder tank and a pre-heater, and is capable of cooling quickly in a cooling device simultaneously. SOLUTION: An exhaust...

Full description

Saved in:
Bibliographic Details
Main Authors NAKAMURA HIDEKI, MOTAI SHOHEI
Format Patent
LanguageEnglish
Published 07.10.2004
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide an automatic soldering device which carries out soldering in an inert gas atmosphere, is capable of lowering oxygen in concentration in a jet flow solder tank and a pre-heater, and is capable of cooling quickly in a cooling device simultaneously. SOLUTION: An exhaust device is provided near the inlet of the automatic soldering device, and inert gas of low temperatures is blown out. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030068083