WIRING BOARD
PROBLEM TO BE SOLVED: To provide a wiring board exhibiting high reliability of electrical connection to an external electric circuit board in which a connection pad can be electrically connected with a terminal pad of the external electric circuit board surely over a long term through a conductor bu...
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Main Author | |
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Format | Patent |
Language | English |
Published |
07.10.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a wiring board exhibiting high reliability of electrical connection to an external electric circuit board in which a connection pad can be electrically connected with a terminal pad of the external electric circuit board surely over a long term through a conductor bump, and that connection can be secured even if a stress due to difference of thermal expansion coefficient between an insulating substrate and the external electric circuit board is increased. SOLUTION: A wiring conductor 2 is formed in a square insulating substrate 1 of ceramics, and a large number of connection pads 3 connected electrically with the wiring conductor 2 are arranged longitudinally and latitudinally in a square region on one major surface of the insulating substrate 1 of a wiring board 5. The connection pad 3 consists of a first connection pad 3a formed on one major surface of the insulating substrate 1, and a second connection pad 3b formed on the bottom face of a groove 4 formed on one major surface of the insulating substrate 1 along the diagonal thereof. Thermal stress being applied to the connection pad 3 can be relaxed especially in the diagonal direction of the insulating substrate 1 where thermal stress acts significantly resulting in a wiring board 5 exhibiting high reliability of electrical connection. COPYRIGHT: (C)2005,JPO&NCIPI |
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Bibliography: | Application Number: JP20030067239 |