WIRING BOARD

• Main Author: OUCHI TAKUYA
• Format: Patent
• Language: English
• Published: 07.10.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a wiring board exhibiting high reliability of electrical connection to an external electric circuit board in which a connection pad can be electrically connected with a terminal pad of the external electric circuit board surely over a long term through a conductor bump, and that connection can be secured even if a stress due to difference of thermal expansion coefficient between an insulating substrate and the external electric circuit board is increased. SOLUTION: A wiring conductor 2 is formed in a square insulating substrate 1 of ceramics, and a large number of connection pads 3 connected electrically with the wiring conductor 2 are arranged longitudinally and latitudinally in a square region on one major surface of the insulating substrate 1 of a wiring board 5. The connection pad 3 consists of a first connection pad 3a formed on one major surface of the insulating substrate 1, and a second connection pad 3b formed on the bottom face of a groove 4 formed on one major surface of the insulating substrate 1 along the diagonal thereof. Thermal stress being applied to the connection pad 3 can be relaxed especially in the diagonal direction of the insulating substrate 1 where thermal stress acts significantly resulting in a wiring board 5 exhibiting high reliability of electrical connection. COPYRIGHT: (C)2005,JPO&NCIPI