ELECTROCONDUCTIVE ADHESIVE

PROBLEM TO BE SOLVED: To provide an electroconductive adhesive which excels in reworkableness without requiring a lot of time and cost, can inhibit migration of an electroconductive metal, can improve adhesiveness properly balanced, and furthermore does not damage a printed board. SOLUTION: The elec...

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Bibliographic Details
Main Author YANAI MASAHIRO
Format Patent
LanguageEnglish
Published 07.10.2004
Edition7
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
CONDUCTORS
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide an electroconductive adhesive which excels in reworkableness without requiring a lot of time and cost, can inhibit migration of an electroconductive metal, can improve adhesiveness properly balanced, and furthermore does not damage a printed board. SOLUTION: The electroconductive adhesive comprises at least a thermoplastic resin, a thermosetting compound, and an electroconductive filler, and the thermosetting compound contains at least a compound having a divalent sulfur atom. COPYRIGHT: (C)2005,JPO&NCIPI
Bibliography:Application Number: JP20030066681