SEMICONDUCTOR DEVICE

• Main Author: SEKIGUCHI KIYOSHI
• Format: Patent
• Language: English
• Published: 30.09.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To obtain a semiconductor device that can be reduced in radiation noise or improved in the quality of signal waveforms. SOLUTION: This semiconductor device has solder balls 3 formed on connection pads in coating states and electronic components 4 mounted between two solder balls 3 lying in rows. In a method of realizing this semiconductor device, for example, the electronic components 4 are first mounted on a base substrate 2 and, thereafter, the solder balls 3 are formed in a reflow soldering step through a step of applying cream solder. In a BGA package thus constituted, a gap corresponding to at least the thicknesses of the electronic components 4 is secured between a mother board 11 and the base substrate 2 at the time of mounting the mother board 11 on the substrate 2. In addition, when the solder balls 3 are melted at the time of mounting the mother board 11, the occurrence of troubles caused by the nonuniform melting of the solder balls 3 can be avoided efficiently. Consequently, the occurrence of troubles caused by the nonuniform melting of the solder balls 3 can be avoided efficiently. Moreover, it becomes unnecessary to secure the mounting locations of the electronic components 4 on the mother board 11. Consequently, the size of the mother board 11 can be reduced and the density of the board 11 can be increased. COPYRIGHT: (C)2004,JPO&NCIPI