WIRING BOARD

• Main Author: OUCHI TAKUYA
• Format: Patent
• Language: English
• Published: 16.09.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To solve a problem that electric short-circuiting takes place between connection pads through solder bridges formed due to intricate warping of the entire wiring board or high density connection pads. SOLUTION: The wiring board comprises a ceramic insulating substrate 1 having multiple wiring conductors formed internally, first connection pads 2a arranged longitudinally and latitudinally on one major surface of the insulating substrate 1 while connected electrically with the wiring conductors, and second connection pads 2b connected electrically with wiring conductors consisting of metallized conductors formed from the inner surface of groove-like recesses, made in the side face of the insulating substrate 1 from one major surface side to the other major surface side, to one major surface. Since the stress applied to the first connection pad 2a can be relaxed effectively by the second connection pad 2b, the first connection pad 2a can be electrically connected surely with the terminal pad of an external electric circuit board over a long term together with the second connection pad 2b. COPYRIGHT: (C)2004,JPO&NCIPI