THERMOPLASTIC RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a resin composition comprising a polyphenylene ether resin and a polyamide resin which gives impact resistance and rigidity in a wide range of temperature, is excellent in tensile characteristics, and has improved heat aging resistance. SOLUTION: In this resin compos...

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Bibliographic Details
Main Authors NAKABASHI JUNICHI, HORIO MITSUHIRO
Format Patent
LanguageEnglish
Published 16.09.2004
Edition7
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PROBLEM TO BE SOLVED: To provide a resin composition comprising a polyphenylene ether resin and a polyamide resin which gives impact resistance and rigidity in a wide range of temperature, is excellent in tensile characteristics, and has improved heat aging resistance. SOLUTION: In this resin composition which comprises the polyamide resin (A), the polyphenylene ether resin (B), a hydrogenated block copolymer (C) consisting of at least two styrene polymer blocks and at least two olefin elastomer blocks and, as a modifier, a compound having a carboxylic acid group, an acid anhydride group, an epoxy group, an amino group or a hydroxy group, the polyamide forms a continuous phase and its volume fraction is 44-70 vol%. The components (B) and (C) form dispersed phases and their dispersed particle sizes are not more than 1.2 μm. COPYRIGHT: (C)2004,JPO&NCIPI
Bibliography:Application Number: JP20040180381