CONNECTING STRUCTURE FOR ELECTRONIC COMPONENT

• Main Authors: UMADOKORO HIROYUKI, IWASAKI SHOJI, SUDA TADAAKI, MIZUGUCHI NAOSHI, WATANABE HIROTO, HORI NOBUYUKI, KASAI TOSHIO
• Format: Patent
• Language: English
• Published: 02.09.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DEVICES USING STIMULATED EMISSION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide the connecting structure of electronic components capable of simplifying working to a wiring board to which the electronic components are connected, and increasing the reliability of the connection of lead electrodes. SOLUTION: The bent portion 21b of a flexible wiring board 21 having bending elasticity in board thickness direction is interpolated into a plurality of lead electrodes 34 to 36 of a laser diode 11 in a status that it is bent to the board thickness direction, and connecting lands 24 to 26 are butted to the lead electrodes 34 to 36 by the elasticity restoring force of the flexible wiring board 21. Thus, the reliability of the connection is increased by stably holding the status that the lead electrodes are soldered to the respective connecting lands. Therefore, it is not necessary to open any through-hole for interpolating the lead electrodes in the flexible wiring board 21, and it is not necessary to form any reinforcing board. Thus, it is possible to simplify working to the flexible wiring board. COPYRIGHT: (C)2004,JPO&NCIPI