METHOD FOR MANUFACTURING SUBSTRATE FOR PRECISION COMPONENT

• Main Authors: TAKASHINA SHIGEAKI, YONEDA YASUHIRO, HAGIWARA TOSHIYA
• Format: Patent
• Language: English
• Published: 02.09.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a method capable of highly flattening a substrate for a precision component. SOLUTION: The flattening method comprises a 1st process for polishing the substrate by polishing load of 50-1,000 hPa (P1), by using a 1st polishing solution composition containing silica pa...