METHOD FOR DRYING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for drying a substrate that can prevent the occurrence of a water mark and has satisfactory throughput even in the substrate having a surface, where the strength of hydrophilic properties is different. SOLUTION: In a substrate treating method for removing a...

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Bibliographic Details
Main Author ONO HIROKI
Format Patent
LanguageEnglish
Published 12.08.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
DRYING
DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEATING
LIGHTING
MECHANICAL ENGINEERING
SEMICONDUCTOR DEVICES
WEAPONS
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Summary:PROBLEM TO BE SOLVED: To provide a method for drying a substrate that can prevent the occurrence of a water mark and has satisfactory throughput even in the substrate having a surface, where the strength of hydrophilic properties is different. SOLUTION: In a substrate treating method for removing a liquid DIW adhering onto the surface of a substrate W, the surface of the substrate W has portions 10, 11 where the strength of hydrophilic properties is different each other. Rotating the substrate W removes the liquid DIW from the portion 10 whose hydrophilic properties are weak. Increasing a rotational speed for rotating the substrate W removes the liquid DIW from the portion 11 whose hydrophilic properties are strong. COPYRIGHT: (C)2004,JPO&NCIPI
Bibliography:Application Number: JP20030012098