WIRING BOARD AND LIGHT EMITTING DEVICE

PROBLEM TO BE SOLVED: To provide a wiring board that can efficiently radiate heat generated from a heating component when mounting the heating component such as a light emitting element, has excellent heat resistance and light resistance, further facilitate mechanical machining and can be made thin....

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Bibliographic Details
Main Authors NAKAGAWA TERUO, NAKANISHI HIDEO
Format Patent
LanguageEnglish
Published 12.08.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a wiring board that can efficiently radiate heat generated from a heating component when mounting the heating component such as a light emitting element, has excellent heat resistance and light resistance, further facilitate mechanical machining and can be made thin. SOLUTION: The wiring board is provided with a metal-made base substance 3, an insulating layer 5 consisting of ceramics provided for the base substance 3, and a conductor wiring 4 provided so as to be in contact with the insulating layer 5 and not to be in contact with the base substance 3. COPYRIGHT: (C)2004,JPO&NCIPI
Bibliography:Application Number: JP20030011675