MANUFACTURING METHOD OF THIN PLATE QUARTZ CRYSTAL WAFER AND QUARTZ CRYSTAL RESONATOR

• Main Authors: KUROSAWA TAMOTSU, ONO KOZO, CHIBA AKIO
• Format: Patent
• Language: English
• Published: 29.07.2004
• Edition: 7
• Subjects: AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR; BASIC ELECTRONIC CIRCUITRY; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CRYSTAL GROWTH; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE; REFINING BY ZONE-MELTING OF MATERIAL; RESONATORS; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE; SINGLE-CRYSTAL-GROWTH; SOLDERING OR UNSOLDERING; TRANSPORTING; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; WELDING; WORKING BY LASER BEAM; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin plate quartz crystal wafer that enhances the productivity, and to provide a method for manufacturing an inexpensive quartz crystal resonator. SOLUTION: In the method for manufacturing the thin plate quartz crystal wafer of which the main face is flatted from a quartz crystal block by cutting out a synthetic quartz crystal block to form the thin plate quartz crystal wafer, the method is characterized by converging a laser light to a determined area under the main face of the quartz crystal block to form the multi-photon state, cutting the Si-O-Si bond of the quartz crystal to form cavities and sequentially peeling the thin plate quartz crystal wafer from the surface of the quartz crystal block. Also, the quartz crystal resonator is obtained from the same. COPYRIGHT: (C)2004,JPO&NCIPI