POLISHING LIQUID COMPOSITION

• Main Authors: TAKASHINA SHIGEAKI, YONEDA YASUHIRO, HAGIWARA TOSHIYA
• Format: Patent
• Language: English
• Published: 22.07.2004
• Edition: 7
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DRESSING OR CONDITIONING OF ABRADING SURFACES; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PERFORMING OPERATIONS; POLISHES; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a polishing liquid composition capable of efficiently flattening a substrate having irregularities on the surface to be polished to a high level, to provide a method for polishing the substrate having irregularities on the surface to be polished using the polishing liquid composition to flatten the substrate, to provide a method for flattening the substrate to be polished using the polishing liquid composition and to provide a method for manufacturing a semiconductor device having a step of polishing a semiconductor substrate using the polishing liquid composition. SOLUTION: The polishing liquid composition comprises a silica particle, a polymer particle and a cationic compound in an aqueous medium. The method for polishing the substrate to be polished uses the polishing liquid composition. The method for flattening the substrate to be polished uses the polishing liquid composition. The method for manufacturing the semiconductor device has a step of polishing the semiconductor substrate using the polishing liquid composition. COPYRIGHT: (C)2004,JPO&NCIPI