METHOD OF FORMING THICK-FILM WIRING AND METHOD OF MANUFACTURING LAMINATED ELECTRONIC COMPONENT

• Main Authors: FUJII CHIYOUICHIROU, ODA TETSUYA, NISHIKAWA ETSUO
• Format: Patent
• Language: English
• Published: 15.07.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINING MACHINES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; PRINTING; PRINTING MACHINES OR PRESSES; SEMICONDUCTOR DEVICES; STAMPS; TRANSPORTING; TYPEWRITERS

PROBLEM TO BE SOLVED: To provide a method of forming a thick-film wiring capable of surely transferring electrically conductive paste from an intaglio plate to a substrate even if the thickness of the electrically conductive paste exceeds a predetermined value. SOLUTION: Electrically conductive photosensitive paste P is filled into patterned grooves on a translucent intaglio plate 1, on the surface of which patterned grooves 2 that correspond to a desired thick-film wiring pattern are formed. Under a condition that a translucent intermediate member 8 is overlapped onto the intaglio plate, the intaglio plate and the intermediate member are irradiated with lights from both of their front and back sides to generate a curing reaction to harden the electrically conductive paste until its overall peripheral surfaces reach a predetermined hardness. The electrically conductive paste hardened in the intaglio plate 1 is transferred to the intermediate member 8. The electrically conductive paste on the intermediate plate 8 is then retransferred to the substrate 20. Thick-film wiring is formed on the substrate 20 by firing the electrically conductive paste. COPYRIGHT: (C)2004,JPO&NCIPI