WIRING BOARD

PROBLEM TO BE SOLVED: To provide a wiring board that is superior in connection reliability, without discontinuity between a wiring conductor and a wiring conductor layer, even if long-term thermal history is repeatedly applied over a long time. SOLUTION: The wiring board is formed, by stacking alter...

Full description

Saved in:
Bibliographic Details
Main Author SHIMONOSONO MASARU
Format Patent
LanguageEnglish
Published 15.07.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a wiring board that is superior in connection reliability, without discontinuity between a wiring conductor and a wiring conductor layer, even if long-term thermal history is repeatedly applied over a long time. SOLUTION: The wiring board is formed, by stacking alternately an insulation layer 1 that a heat resistance fiber substrate is impregnated with a thermosetting resin and a wiring conductor 2 and further stacking alternately an insulating resin layer 6 and a wiring conductor layer 7 on a core substrate 5 that is formed by electrically connecting the wiring conductors 2 located vertically with the insulation layer in-between, through a through-conductor 4 with a through-hole 3 formed in the insulation layer 1 is filled with a conductor material. The through-hole 3 that is formed in the insulation layer 1 on the outermost side of the core substrate 5 is made smaller in diameter from its internal side toward its surface side. COPYRIGHT: (C)2004,JPO&NCIPI
Bibliography:Application Number: JP20020368655