SUBSTRATE TREATMENT APPARATUS

• Main Authors: WADA TETSUYA, IKEDA FUMIHIDE
• Format: Patent
• Language: English
• Published: 15.07.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To effectively recover raw materials by enhancing a cooling efficiency. SOLUTION: The substrate treatment apparatus is provided with: a reaction chamber where a substrate is treated; an exhaust tube where exhaust gas is exhausted from the reaction chamber; a recovery means 40 provided at the exhaust tube, and where the exhaust gas is cooled to change the phase of a raw material in the exhaust gas, and the raw material is recovered. The recovery means is provided with a plurality of capillaries 52 shunting the exhaust gas flow at the inside of the recovery means. COPYRIGHT: (C)2004,JPO&NCIPI