CIRCUIT MODULE AND ITS MANUFACTURING METHOD
PROBLEM TO BE SOLVED: To provide a circuit module that is compact and inexpensive and superior in fitting precision of flip chip components. SOLUTION: In the circuit module, an insulation layer 10 is formed covering mostly the entire surface of a first surface 1a or a second surface 1b of a circuit...
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Main Author | |
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Format | Patent |
Language | English |
Published |
08.07.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a circuit module that is compact and inexpensive and superior in fitting precision of flip chip components. SOLUTION: In the circuit module, an insulation layer 10 is formed covering mostly the entire surface of a first surface 1a or a second surface 1b of a circuit board 1, and a first flip chip component 5 or a second flip chip component 6 is buried by the insulation layer 10. As a result, the first and second flip chip components 4 and 6 are separately arranged on the first and second surfaces 1a and 1b of the circuit board 1, so that the circuit module is made compact, and while the exposed surface of the insulation layer 10 is used as a reference, a flip chip component located on the opposite side of the buried flip chip component can be mounted and it can be fitted at a correct position with high precision. COPYRIGHT: (C)2004,JPO&NCIPI |
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Bibliography: | Application Number: JP20020360705 |