CIRCUIT MODULE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a circuit module that is compact and inexpensive and superior in fitting precision of flip chip components. SOLUTION: In the circuit module, an insulation layer 10 is formed covering mostly the entire surface of a first surface 1a or a second surface 1b of a circuit...

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Bibliographic Details
Main Author HIROSE YOSHITAKA
Format Patent
LanguageEnglish
Published 08.07.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a circuit module that is compact and inexpensive and superior in fitting precision of flip chip components. SOLUTION: In the circuit module, an insulation layer 10 is formed covering mostly the entire surface of a first surface 1a or a second surface 1b of a circuit board 1, and a first flip chip component 5 or a second flip chip component 6 is buried by the insulation layer 10. As a result, the first and second flip chip components 4 and 6 are separately arranged on the first and second surfaces 1a and 1b of the circuit board 1, so that the circuit module is made compact, and while the exposed surface of the insulation layer 10 is used as a reference, a flip chip component located on the opposite side of the buried flip chip component can be mounted and it can be fitted at a correct position with high precision. COPYRIGHT: (C)2004,JPO&NCIPI
Bibliography:Application Number: JP20020360705