THERMALLY DEVELOPABLE MATERIAL CONTAINING BACKSIDE CONDUCTIVE LAYER
PROBLEM TO BE SOLVED: To improve the conductive layer of thermally developable material containing a backside conductive layer. SOLUTION: The thermally developable material is obtained by disposing, on the backside of a support of thermally developable material, (a) a first layer comprising a film-f...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
24.06.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To improve the conductive layer of thermally developable material containing a backside conductive layer. SOLUTION: The thermally developable material is obtained by disposing, on the backside of a support of thermally developable material, (a) a first layer comprising a film-forming polymer and (b) a non-imaging backside conductive layer that is interposed between the support and the first layer and makes the first layer adhere directly to the support, wherein the backside conductive layer comprises non-acicular metal antimonate particles in a mixture of two or more polymers that include a first polymer serving to promote direct adhesion of the backside conductive layer to the support, and a second polymer that is different from and forms a single phase mixture with the first polymer. COPYRIGHT: (C)2004,JPO |
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Bibliography: | Application Number: JP20030395591 |