MANUFACTURING METHOD FOR QUARTZ OSCILLATOR
PROBLEM TO BE SOLVED: To reduce the cost of deposition by decreasing the time of formation for corrosion-resistant films from two times in convention to one time, and to attain a high yield of a product by eliminating a defect such as a pin hole caused at working a quartz crystal with a hydrofluoric...
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Main Author | |
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Format | Patent |
Language | English |
Published |
17.06.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To reduce the cost of deposition by decreasing the time of formation for corrosion-resistant films from two times in convention to one time, and to attain a high yield of a product by eliminating a defect such as a pin hole caused at working a quartz crystal with a hydrofluoric acid etching liquid. SOLUTION: This manufacturing method for manufacturing a quartz oscillator comprises: a step B for forming a thin corrosion-resistant film, for working the outline of the quartz oscillator, on both surfaces of a quartz substrate to pattern; a step C for forming a resist pattern for forming a recessed part in front and rear surfaces of the quartz oscillator; a step D for etching the outline of the quartz oscillator without penetrating; a step E for etching the corrosion-resistant film of the recessed part to expose a quartz surface; a step F for etching again and penetrating the outline of the quartz, and further etching the quartz surface where the recessed part is exposed, to form a recessed part; a step G for forming a thin film for an electrode; a step H for peeling off a resist and the electrode thin film thereon; and a step I for etching the corrosion-resistant film left on the quartz substrate. COPYRIGHT: (C)2004,JPO |
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Bibliography: | Application Number: JP20020373266 |