MANUFACTURING METHOD FOR LED SUBSTRATE

PROBLEM TO BE SOLVED: To solve the problem that the printing quality of a color tandem machine is not improved due to adverse effects to the printing quality by a variation in the pitch between LED array chips because the LED array chip is mounted on an LED substrate with a deviation from a target p...

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Bibliographic Details
Main Author HORIUCHI TAKEYOSHI
Format Patent
LanguageEnglish
Published 17.06.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CORRECTION OF TYPOGRAPHICAL ERRORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
SELECTIVE PRINTING MECHANISMS
SEMICONDUCTOR DEVICES
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:PROBLEM TO BE SOLVED: To solve the problem that the printing quality of a color tandem machine is not improved due to adverse effects to the printing quality by a variation in the pitch between LED array chips because the LED array chip is mounted on an LED substrate with a deviation from a target position within the positioning precision range of a die bonder. SOLUTION: Some LED array chips are positioned at an absolute position and mounted. Then, the remaining LED array chips are positioned at a relative position to the mounted LED array chips, and mounted. A relative position deviation of a joint of LED arrays is restricted to a minimum, so that the printing quality can be improved. COPYRIGHT: (C)2004,JPO
Bibliography:Application Number: JP20020337047