PRINTED-CIRCUIT-BOARD MANUFACTURING METHOD, AND CIRCUIT BOARD FORMED THEREBY

• Main Authors: COOK LEE, BAYES MARTIN W, LEFEBVRE MARK
• Format: Patent
• Language: English
• Published: 30.04.2004
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To improve the flattening of the surface of the substrate of a printed circuit board and the adhesive strengths of conductors to the surface thereof. SOLUTION: An adjusting method of the substrate of a printed circuit board includes a step for contacting a flattening liquid with at least a portion of the surface of the substrate of the printed circuit board, a step for contacting a polishing component with the flattened surface, and a step for generating on the surface of the printed circuit board the surface-texture whose roughness has a sectional area smaller than the sectional area of the minimum wiring feature present on the substrate of the printed circuit board. In this case, the flattening liquid contains a liquid carrier and the components for removing arbitrarily materials from the substrate of the printed circuit board. Also, in this case, the contact includes a plurality of random contact-motions, predetermined contact-motions, or combinations of them with each other which are performed on the surface of the printed circuit board. COPYRIGHT: (C)2004,JPO