RESIN WITH LOW VOID SPACE AND METHOD FOR PREPARING THE SAME
PROBLEM TO BE SOLVED: To provide a polymer bead having void spaces of ≤5 μm and slightly crosslinked, and to provide a method for producing the same. SOLUTION: This crosskinked polymer bead comprises a polymer containing 0.5-2.0 mol% of a crosslinking agent, has a diameter of ≤200 μm, has no void sp...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
30.04.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a polymer bead having void spaces of ≤5 μm and slightly crosslinked, and to provide a method for producing the same. SOLUTION: This crosskinked polymer bead comprises a polymer containing 0.5-2.0 mol% of a crosslinking agent, has a diameter of ≤200 μm, has no void spaces having a diameter of >5 μm, and contains an extractable organic substance in an amount of <5 wt%. The method for producing the polymer bead comprises (a) preparing a mixture of a monomer component comprising at least one vinyl monomer and at least one crosslinking agent and at least one free-radical initiator in an amount of 0.25-1.5 mol% in a container, (b) introducing an inert gas into the container and removing oxygen from the mixture and the container, so as to have an oxygen content of ≤ 5%, (c) polymerizing the monomer mixture, and (d) washing the formed bead with an aprotic organic solvent. COPYRIGHT: (C)2004,JPO |
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Bibliography: | Application Number: JP20030293726 |