APPARATUS FOR BONDING BLANK BY FOLDING

PROBLEM TO BE SOLVED: To provide an apparatus for bonding a blank by folding capable of achieving miniaturization of the whole of the apparatus and saving a space. SOLUTION: The apparatus for bonding a blank by folding is equipped with a first fold processing part 10 for folding the blank W along ei...

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Bibliographic Details
Main Author KIMURA NAONOBU
Format Patent
LanguageEnglish
Published 15.04.2004
Edition7
Subjects
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Summary:PROBLEM TO BE SOLVED: To provide an apparatus for bonding a blank by folding capable of achieving miniaturization of the whole of the apparatus and saving a space. SOLUTION: The apparatus for bonding a blank by folding is equipped with a first fold processing part 10 for folding the blank W along either ruled line K2of central two ruled lines and a second fold processing part 20 for folding the blank W along the next ruled line K4but one from the ruled line K2and bonding the folded surface E to a piled up surface A. The surfaces A and E bonded with the second folding part 20 are fixed by pressure with a pressure fixing part 30. The blank W pressure fixed with the pressure fixing part 30 is raised in a box state body C with a raising part 40 and further folded along other ruled lines K1and K3which are not folded. COPYRIGHT: (C)2004,JPO
Bibliography:Application Number: JP20020279852