MANUFACTURING METHOD OF WIRING BOARD

PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which has a buildup layer only on the upper side of the surface of a core substrate and is resistant to bending, and also precisely forms an opening having a predetermined inside diameter on the back face insulating layer incl...

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Bibliographic Details
Main Author OTA SUMIO
Format Patent
LanguageEnglish
Published 08.04.2004
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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