MANUFACTURING METHOD OF WIRING BOARD

• Main Author: OTA SUMIO
• Format: Patent
• Language: English
• Published: 08.04.2004
• Edition: 7
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which has a buildup layer only on the upper side of the surface of a core substrate and is resistant to bending, and also precisely forms an opening having a predetermined inside diameter on the back face insulating layer including an inorganic fiber. SOLUTION: The manufacturing method of a wiring board 1 includes a core substrate 2 having a surface 4 and a back face 5 thereof, a surface-wiring layer 8 and a back face wiring layer 9 that are formed on the surface 4 and the back face 5, and through hole conductors 6 that are penetrated thorough the surface 4 and the back face 5 and also connected to the surface wiring layer 8 and the back face-wiring layer 9. The manufacturing method includes a laminating process that forms the back face-insulating layer 11 on the back face 5 of the core substrate 2 and on the upper side of the back face-wiring layer 9, and a drilling process that forms an opening 15 having the back-face wiring layer 9 exposed at a bottom face thereof by providing laser beam machining on the insulating layer 11. The drilling process forms the opening 15 having the inside diameter larger than the outside diameter of a carbon dioxide laser L by rotating the center of the carbon dioxide laser L along the circumference of the center of the opening 15 formed on the insulating layer 11. COPYRIGHT: (C)2004,JPO