MULTILAYER INTERCONNECTION BOARD

PROBLEM TO BE SOLVED: To provide a multilayer interconnection board which does not warp or is hard to warp, and has a buildup layer only on the surface of a core board. SOLUTION: Multilayer interconnection board 1 comprises a core board 2 comprising a front surface 3 and a rear surface 4, and a buil...

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Bibliographic Details
Main Author OTA SUMIO
Format Patent
LanguageEnglish
Published 25.03.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a multilayer interconnection board which does not warp or is hard to warp, and has a buildup layer only on the surface of a core board. SOLUTION: Multilayer interconnection board 1 comprises a core board 2 comprising a front surface 3 and a rear surface 4, and a buildup layer BU which is formed on the front surface 3 of the core board 2 and composed of a plurality of insulating layers 18 and 24 and a plurality of wiring layers 22 and 28 positioned between the layers. The core board 2 comprises an intermediate insulating layer 5 comprising a front surface 6 and a rear surface 7, a surface insulating layer 8 formed on the front surface 6 of the intermediate insulating layer 5, and a rear surface insulating layer 9 formed on the rear surface 7 of the intermediate insulating layer 5, with thickness t2 of the rear surface insulating layer 9 larger than thickness t1 of the front surface insulating layer 8. COPYRIGHT: (C)2004,JPO
Bibliography:Application Number: JP20020254966