ELASTIC WAVE DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a hermetically sealed elastic wave device, without causing the size increase, and to provide a method of manufacturing a compact and high-reliability elastic wave device for inputting/outputting electronic signals, without using a metal wire, etc. SOLUTION: An SAW de...

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Bibliographic Details
Main Authors SATO YOSHIO, HASHIMOTO KIYONARI
Format Patent
LanguageEnglish
Published 11.03.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a hermetically sealed elastic wave device, without causing the size increase, and to provide a method of manufacturing a compact and high-reliability elastic wave device for inputting/outputting electronic signals, without using a metal wire, etc. SOLUTION: An SAW device is formed with an IDT pattern 11 on a piezoelectric board 10 with a hollow 22 formed in a cover 20 to form a hollow space over the pattern 11. The cover 20 has through-holes 21 for introducing electric signals to the SAW device. A chip 1 composed of the piezoelectric board 10 and the cover 20 has metal bumps 31 in the holes 21 and is face-down-bonded to a circuit board 30. The piezoelectric board 10 has a peripheral metal film 13 surrounding the pattern 11 and electrode pads 12 to more raise the hermetic seal in the chip 1. COPYRIGHT: (C)2004,JPO
Bibliography:Application Number: JP20020236151