IMAGING DEVICE, AND MOLDED SUBSTRATE FOR IMAGING DEVICE

• Main Author: URAKAWA TOSHIYA
• Format: Patent
• Language: English
• Published: 04.03.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a molded substrate for an imaging device in order to easily align a semiconductor chip with a lens for making incident light on the semiconductor chip when assembling the imaging device using a flip chip mounting method of the semiconductor chip, and to provide the imaging device using the same. SOLUTION: The imaging device has the lens for making incident light on the semiconductor chip mounted on the substrate, the resin molded part for fixing the lens barrel portion holding the lens is provided in one surface of the substrate, the through hole for optical passage is opened by the substrate, and the semiconductor chip is mounted so that this through hole may be covered to the surface of the other of the substrate. The resin molded part of the molded substrate for the imaging units to fix the lens barrel portion holding the lens to one surface is provided, and the through hole for optical passage is opened in this resin molded part, and is mounted with the semiconductor chip to mount the circuit side toward the through hole with covering the through hole at the other surface. COPYRIGHT: (C)2004,JPO