TRANSMISSION LINE SUBSTRATE FOR HIGH FREQUENCY AND METHOD FOR MANUFACTURING SAME

• Main Author: ITAKURA HIDEAKI
• Format: Patent
• Language: English
• Published: 26.02.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE; SEMICONDUCTOR DEVICES; WAVEGUIDES

PROBLEM TO BE SOLVED: To provide a transmission line substrate for a high frequency and its manufacturing method for widening the wire bonding area of a metallic conductor pattern for ground formed at the surface side of a dielectric base material, and for increasing the bonding reliability of a metallic conductor film for connecting the metallic conductor pattern for ground formed at the surface side to a metallic conductor pattern for ground formed at the backside to the dielectric base material. SOLUTION: This transmission line substrate 10 for a high frequency is configured by arranging a metallic conductor line 12 for a signal line for making a high frequency signal pass and a first metallic conductor pattern 13 for ground on the surface of a dielectric base material 11 and a second metallic conductor pattern 14 for ground on the backside, and arranging a metallic conductor film 15 formed in a through-hole 19 put through the dielectric base material 11 for connecting the first and second metallic conductor patterns 13 and 14. In this case, the first metallic conductor pattern 13 and the second metallic conductor pattern 14 are connected through a casteration 16 formed on the edge face of the dielectric base material 11 formed by cutting the through-hole 19. COPYRIGHT: (C)2004,JPO