SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, ITS MANUFACTURING METHOD AND IC CARD

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device which prevents unauthorized decryption, and also provide its manufacturing method which prevents drop in yield and an IC card using the same. SOLUTION: In the semiconductor integrated circuit device, a semiconductor chip 5, o...

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Bibliographic Details
Main Authors MUKAI TOSHIO, FUKUOKA KOJI
Format Patent
LanguageEnglish
Published 26.02.2004
Edition7
Subjects
CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device which prevents unauthorized decryption, and also provide its manufacturing method which prevents drop in yield and an IC card using the same. SOLUTION: In the semiconductor integrated circuit device, a semiconductor chip 5, on whose one surface a circuit pattern is formed, is provided opposite to the circuit pattern on an electrode plate 6, and a leaf spring 1, which is an elastic body, bent into a circular shape by elastic force is flatly bonded to the other side surface, where the circuit pattern of the semiconductor chip 5 is not formed, via a first adhesive 4, and an reinforcing plate 2 keeping the leaf spring 1 flat in a state, which is an elastic body, is also bonded to the leaf spring 1, which is an elastic body, by a second adhesive 3. The semiconductor chip 5, the leaf spring 1 and the reinforcing plate 2 are mounted on an electrode plate 6. COPYRIGHT: (C)2004,JPO
Bibliography:Application Number: JP20020220890