COOLING MECHANISM OF INFORMATION PROCESSOR

PROBLEM TO BE SOLVED: To reduce the size of an information processor and reduce noise from the processor by suppressing a temperature rise in a housing of the information processor and overheat of a power supply unit due to mounting a high-heat generation processor. SOLUTION: The heat generation 32...

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Bibliographic Details
Main Authors OIKAWA HIRONORI, TOIZONO TAKESHI
Format Patent
LanguageEnglish
Published 12.02.2004
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To reduce the size of an information processor and reduce noise from the processor by suppressing a temperature rise in a housing of the information processor and overheat of a power supply unit due to mounting a high-heat generation processor. SOLUTION: The heat generation 32 of the processor is discharged outside, and also the heat 33 is discharged outside the housing by a fan 11b which is mounted on the power supply unit 11 to discharge the heat. In this case, since the generating heat 32 of the processor does not pass through a high-heat generating part 11c of the power supply unit, the overheat of the power supply unit can be suppressed. Since the fan 11b for discharging the heat can stop when the processor is hardly heated, the noise can be suppressed to the minimum. COPYRIGHT: (C)2004,JPO
Bibliography:Application Number: JP20020203455