PLATING APPARATUS AND PLATING METHOD

• Main Authors: IWATA MASUMITSU, TAKAI YASUYOSHI, TOYAMA JO, HAYASHI SUSUMU, TSUZUKI EIJU, SONODA YUICHI, MIYAMOTO YUSUKE
• Format: Patent
• Language: English
• Published: 05.02.2004
• Edition: 7
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To reduce the deposition of a plating layer to the back face of a substrate when electroplating is applied to the surface of the substrate. SOLUTION: A long-length substrate 303 is continuously fed to a plating bath 307 containing at least metallic ions. A counter electrode 305...