PLATING APPARATUS AND PLATING METHOD

PROBLEM TO BE SOLVED: To reduce the deposition of a plating layer to the back face of a substrate when electroplating is applied to the surface of the substrate. SOLUTION: A long-length substrate 303 is continuously fed to a plating bath 307 containing at least metallic ions. A counter electrode 305...

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Bibliographic Details
Main Authors IWATA MASUMITSU, TAKAI YASUYOSHI, TOYAMA JO, HAYASHI SUSUMU, TSUZUKI EIJU, SONODA YUICHI, MIYAMOTO YUSUKE
Format Patent
LanguageEnglish
Published 05.02.2004
Edition7
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To reduce the deposition of a plating layer to the back face of a substrate when electroplating is applied to the surface of the substrate. SOLUTION: A long-length substrate 303 is continuously fed to a plating bath 307 containing at least metallic ions. A counter electrode 305 is oppositely arranged below the lower face of the long-length substrate 303 to form a plating layer, an electroconductive member 304 for suppressing film deposition is oppositely arranged above the upper face of the long-length substrate 303, and the electric potential of the electrically conductive member 304 and that of the long-length substrate 303 are made almost equal. Thus, the deposition of the plating layer to the upper face of the long-length substrate 303 can be reduced. COPYRIGHT: (C)2004,JPO
Bibliography:Application Number: JP20020195172