METHOD FOR DETERMINING FLATNESS OF SUBSTRATE FOR ELECTRONIC DEVICE, PRODUCTION METHOD AND METHOD FOR PRODUCING MASK BLANK AND MASK FOR TRANSFER

• Main Authors: KOIKE KESAHIRO, TOCHIHARA YASUTAKA
• Format: Patent
• Language: English
• Published: 29.01.2004
• Edition: 7
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method for producing a mask blank and a mask for transfer in which the flatness of a mask blank becomes the desired value, even when a thin film itself has film stress, a mask has high accuracy of pattern position, and dislocation of a pattern and pattern defects do not occur in pattern transfer, and also to provide a method for determining the flatness of a transparent substrate for an electronic device used in the above method, and a production method for the substrate. SOLUTION: In the method for determining the flatness of a transparent substrate for an electronic device, the flatness of a transparent substrate for an electronic device is determined so that the flatness of a mask blank becomes the desired value in consideration of a variation in flatness due to the film stress of a thin film formed on the principal surface of the transparent substrate. The flatness of a transparent substrate is measured, load type for polishing of the substrate is selected according to the measured flatness, and the transparent substrate is polished to adjust the flatness of the substrate. The method for producing a mask blank and a mask for transfer uses the above method. COPYRIGHT: (C)2004,JPO