LIQUID DROP JETTING HEAD AND INKJET RECORDER

PROBLEM TO BE SOLVED: To reduce the size of chip and the mounting cost thereof by forming an electrode pad for applying a driving voltage for deforming a diaphragm on the support substrate side of the diaphragm/liquid chamber substrate. SOLUTION: A nozzle plate 10 is bonded to a first substrate 30....

Full description

Saved in:
Bibliographic Details
Main Authors KURODA TAKAHIKO, ABE SHUYA, TOYODA GENJIRO
Format Patent
LanguageEnglish
Published 29.01.2004
Edition7
Subjects
CORRECTION OF TYPOGRAPHICAL ERRORS
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
TRANSPORTING
TYPEWRITERS
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To reduce the size of chip and the mounting cost thereof by forming an electrode pad for applying a driving voltage for deforming a diaphragm on the support substrate side of the diaphragm/liquid chamber substrate. SOLUTION: A nozzle plate 10 is bonded to a first substrate 30. When a pressure is applied to an ejection chamber 32 by an operation of the diaphragm 31, ink is ejected from a nozzle 11. A reinforcing member 20 is provided to reinforce a region where the electrode pad 42 is formed and a pressurizing liquid chamber 32 is not formed. As the strength of a pad taking part can be assured, it is possible to reduce the thickness of the first substrate 30 and the height of a partition wall between the ejection chambers. COPYRIGHT: (C)2004,JPO
Bibliography:Application Number: JP20020189894