LIQUID DROP JETTING HEAD AND INKJET RECORDER
PROBLEM TO BE SOLVED: To reduce the size of chip and the mounting cost thereof by forming an electrode pad for applying a driving voltage for deforming a diaphragm on the support substrate side of the diaphragm/liquid chamber substrate. SOLUTION: A nozzle plate 10 is bonded to a first substrate 30....
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
29.01.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To reduce the size of chip and the mounting cost thereof by forming an electrode pad for applying a driving voltage for deforming a diaphragm on the support substrate side of the diaphragm/liquid chamber substrate. SOLUTION: A nozzle plate 10 is bonded to a first substrate 30. When a pressure is applied to an ejection chamber 32 by an operation of the diaphragm 31, ink is ejected from a nozzle 11. A reinforcing member 20 is provided to reinforce a region where the electrode pad 42 is formed and a pressurizing liquid chamber 32 is not formed. As the strength of a pad taking part can be assured, it is possible to reduce the thickness of the first substrate 30 and the height of a partition wall between the ejection chambers. COPYRIGHT: (C)2004,JPO |
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Bibliography: | Application Number: JP20020189894 |