COPPER FOIL FOR PRINTED WIRING BOARD AND ITS PRODUCING METHOD, AND COPPER CLAD LAMINATE EMPLOYING COPPER FOIL FOR PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a copper foil for making a hole directly by carbon dioxide gas laser under a state where an auxiliary metal layer of nickel and a coating of an organic material for enhancing absorption of laser light are not present on the surface of the outer layer copper foil of a...

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Bibliographic Details
Main Authors SUGIMOTO AKIKO, IZUMITANI KENJIRO, DOBASHI MAKOTO, ITAGAKI YOZO, NAKANO OSAMU, YOSHIOKA ATSUSHI
Format Patent
LanguageEnglish
Published 08.01.2004
Edition7
Subjects
ALLOYS
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
CONDUCTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Summary:PROBLEM TO BE SOLVED: To provide a copper foil for making a hole directly by carbon dioxide gas laser under a state where an auxiliary metal layer of nickel and a coating of an organic material for enhancing absorption of laser light are not present on the surface of the outer layer copper foil of a copper clad laminate. SOLUTION: In the copper foil for producing a printed wiring board having a roughened surface on one side of a bulk copper layer, the bulk copper layer is composed of a high carbon content copper containing carbon by 0.03-0.40 wt.%. COPYRIGHT: (C)2004,JPO
Bibliography:Application Number: JP20020352061