METHOD FOR MANUFACTURING B-STAGE RESIN COMPOSITION SHEET CONTAINING FIBROUS CLOTH BASE MATERIAL FOR ADDITIVE

• Main Author: IKEGUCHI NOBUYUKI
• Format: Patent
• Language: English
• Published: 02.12.2003
• Edition: 7
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

PROBLEM TO BE SOLVED: To provide a method for manufacturing an adhesive sheet which is used for the manufacture of a build-up printed wiring board showing outstanding plating copper adhesive force, heat resistance, modulus of elasticity and reliability, by an additive process. SOLUTION: A metallic f...