METHOD FOR MANUFACTURING B-STAGE RESIN COMPOSITION SHEET CONTAINING FIBROUS CLOTH BASE MATERIAL FOR ADDITIVE

• Main Author: IKEGUCHI NOBUYUKI
• Format: Patent
• Language: English
• Published: 02.12.2003
• Edition: 7
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

PROBLEM TO BE SOLVED: To provide a method for manufacturing an adhesive sheet which is used for the manufacture of a build-up printed wiring board showing outstanding plating copper adhesive force, heat resistance, modulus of elasticity and reliability, by an additive process. SOLUTION: A metallic foil is laminate-bonded on at least one side of a fibrous cloth base material or a B-stage resin composition layer for an additive is laminate-bonded-on one side of a release film, in the thickness of 5 to 50 μm. The resin composition uses a blend of 15 to 500 pts.wt. of (b) an epoxy resin which is liquid at a room temperature for 100 pts.wt. of (a) a polyfunctional ester monomer cyanate and an ester prepolymer cyanate, a blend of 0.005 to 10 pts.wt. of a heat-curing catalyst for 100 pts.wt. of (a+b) and not less than two of the three components such as a butadiene containing resin, organic powder and inorganic powder as essential components. COPYRIGHT: (C)2004,JPO