ELECTRONIC CIRCUIT UNIT

PROBLEM TO BE SOLVED: To provide a thin and inexpensive electronic circuit unit with reliable reflow solder. SOLUTION: In the surface-mounted electronic circuit unit, a circuit board 11 is attached so that a conductive pattern 15 is outside. Electric components 13 positioned inside a cover 1 are ele...

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Bibliographic Details
Main Author KISHIMOTO YOSHIHISA
Format Patent
LanguageEnglish
Published 21.11.2003
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a thin and inexpensive electronic circuit unit with reliable reflow solder. SOLUTION: In the surface-mounted electronic circuit unit, a circuit board 11 is attached so that a conductive pattern 15 is outside. Electric components 13 positioned inside a cover 1 are electrically shielded by the cover 1 and the conductive pattern 15. During reflow soldering since a hot air passes through an opening 6 of the bottom wall 2 and the tip of the leg 5 is soldered to a wiring pattern 12, the height of the cover can be greatly reduced in comparison with a conventional one, and thus, the circuit unit is made thin. In soldering the cover, the solder for electric components is not melted, and consequently, a reliable reflow solder is obtained. COPYRIGHT: (C)2004,JPO
Bibliography:Application Number: JP20020140356