SEMICONDUCTOR DEVICE

• Main Authors: ORIMO MASAICHI, YONEDA YOSHIYUKI, SAKOTA EIJI, TSUJI KAZUTO, NOMOTO TAKASHI, WATANABE EIJI, ONODERA MASANORI
• Format: Patent
• Language: English
• Published: 21.11.2003
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To reduce a cost and improve a reliability and electric characteristics of a semiconductor device wherein external terminal sections are arranged like a lattice on a plane. SOLUTION: The semiconductor device comprises a semiconductor chip 61; a lead 62 which comprises a lead section 66 electrically connected to the semiconductor chip 61 and extended in the outward direction of the semiconductor chip 61, and an external connection terminal section 67 integrally connected to the lead section 66 and extended downwards nearly in the vertical direction with respect to the lead section 66; sealing resin 63 which seals the semiconductor chip 61 and the lead section 66, with a bottom face of the semiconductor chip 61 and a bottom face of the lead section 66 being exposed; and an insulation member 65 which covers at least the bottom face of the semiconductor chip 61 and the bottom face of the lead section 66, and through which the external connection terminal sections 67 is extended. The external connection terminal section 67 comprises a columnar terminal section 68 which is partially embedded in the insulation member 65 and projects from a bottom face of the insulation member 65, and a terminal end 69 which has a multilayer structure with an inner layer and an outer layer being formed of different metals. COPYRIGHT: (C)2004,JPO